Date: 18/03/2011

Applied's new DUV laser scanning detects 40nm particles on wafers

Applied Materials has announced a new technology for inspecting the challenging interconnects layers in 22nm and below memory and logic chips. The new Applied DFinder inspection system is the first darkfield tool to employ deep ultraviolet (DUV) laser technology, providing chip manufacturers with an unprecedented ability to detect exceptionally small particles on patterned wafers in a production environment for higher device yield, says Applied. Because it was designed specifically for interconnect inspection, the DFinder system achieves a cost of ownership up to 40% lower than other darkfield systems - a critical benefit in manufacturing since there can be more than 50 separate inspection steps, ads Applied.

The DFinder system enables the detection of all particles down to 40nm in size. In addition, with its proprietary grazing-angle optical path and full polarization control the system effectively isolates particles from the pattern on production wafers, enabling it to find yield-limiting particles while producing an order of magnitude fewer "false alarm" and nuisance defects.

"Applied's extensive knowledge and experience in thin film deposition provides us with a unique perspective on the inspection technology our customers need for optimizing yield in their next generation chips - a capability that no other equipment company can offer," said Ronen Benzion, vice president and general manager of Applied's Process Diagnostics and Control business unit. "We've built the DFinder system from the ground-up to specifically address a new generation of defects. Our foundry and memory customers are very enthusiastic about this new tool; we have already sold multiple systems and have repeat orders for volume production."

To learn more about the breakthrough DFinder system,
visit www.becauseinnovationmatters.com .