Date: 14/03/2011

Soldering products for low volume, high mix applications from APS Novastar

APS Novastar, LLC has expanded its suite of soldering products to specifically address the needs of low volume, high mix soldering applications. The recent introductions of ESS Selective Soldering Machines, EWS-500 Wave Soldering Machines, and ERO-500 Reflow Ovens are specifically designed for low volume, high mix assemblers providing new easy to operate options at cost-effective entry points for batch soldering applications.

The ESS Selective Soldering Machines are all-inclusive batch soldering systems with on-board, touch screen, micro-controllers, and on-board flux, preheat, and omni-directional soldering. The exceptional accuracy and repeatability along with flexibility to perform single point, drag, mini-wave, and dip soldering, increases solder joint quality and board throughput. For increased productivity and throughput, off-line programming and photoscan software are also available, say APS

The EWS Wave Soldering Machines employ a durable "L" finger handling mechanism allowing for efficient, pallet-less board transport. Continuous width adjustments allow for quick change over for all board widths up to and including twelve (12) inches or 310mm. The streamline design of the EWS Wave Soldering Machines makes maintenance and cleaning easy and the durable welded steel frame construction provides years of reliable service.

The ERO-500 Reflow Oven is a 5-zone, conveyor reflow oven with maximum flexibility in optimizing reflow profiles for lead and lead-free soldering of SMT boards, hybrid boards and curing of glue and thick film pastes. Each heating zone is independently programmable and easily controlled through the on-board LCD system controller. Users can define parameters for conveyor speed, heating temperature, convection heat flow, and cooling fans to control reflow profiles for optimal results.