Date: 26/10/2010

Fairchild Semiconductor introduces MOSFETs in Dual Cool package for better power dissipation

Fairchild Semiconductor has introduced the Dual Cool packaging for MOSFETs. The Dual Cool package is a top-side cooling PQFn device that employs a packaging technology, which enables additional power dissipation through the top of the package. Fairchild aims to help power supply designers who are looking for smaller devices for DC-DC applications, such as power modules, telecommunications and servers to meet design challenges where heat dissipation issues matter more.

MOSFETs with Dual Cool packaging provides an exposed heat slug to reduce thermal resistance from junction to top of case. The release says that this results in 60% higher power dissipation capability than standard PQFN packaging when a heat sink is mounted.

The devices in Dual Cool package presently available include FDMS2504SDC, FDMS2506SDC, FDMS2508SDC, FDMS2510SDC (5mm x 6mm footprint) and FDMC7660DC (3.3mm x 3.3mm footprint). These synchronous rectifying MOSFETs are suggested for DC-DC converters, telecom secondary side rectification and high end server/workstation applications. MOSFETs in the Dual Cool package can be used with or without a heat sink.

Package: Power33 (3.3mm x 3.3mm) and Power56 (5mm x 6mm) Dual Cool

Price:
FDMS2504SDC - Each US$4.14 for 1K pieces.
FDMS2506SDC - Each US$3.46 for 1K pieces.
FDMS2508SDC - Each US$2.70 for 1K pieces.
FDMS2510SDC - Each US$2.08 for 1K pieces.
FDMC7660DC - Each US$1.38 for 1K pieces.

Availability: Sampling now

Delivery: 8-12 weeks ARO