Date: 13/10/2010

IXYS unveils GenX3 IGBTs with SMPD power packages

IXYS has said it has successfully integrated its GenX3 IGBT product line with its new proprietary power package called the "SMPD". The MMIX1G320N60B3 combines the attributes of IXYS' GenX3 B3-Class IGBT product line with SMPD power package. These devices are suggested for applications include power inverters, UPS, motor drives and motor control, SMPS, PFC, UPS, battery chargers, welding machines and higher power lighting controls.

The MMIX1G320N60B3 are optimized for "medium-speed" hard-switching frequencies from 5 kHz to 40 kHz. The square reverse bias safe operating area (RBSOA) feature of this device enhances device ruggedness by insuring safe operation in snubberless, hard switching applications. The MMIX1G320N60B3 supports high current ratings within a single unit, therefore eliminating the need for additional paralleled semiconductors and associated gate drive circuitry.

IXYS' new SMPD power package incorporates a direct copper bond (DCB) ceramic isolator which provides 2500Vrms electrical isolation between die and heat sink. Due to the matched thermal expansion coefficients of silicon and DCB ceramic, mechanical stress to the die and solder caused by power and temperature cycling is reduced, thus improving the reliability of the device. The SMPD power package features an ultra-low package profile (5.3mm height x 24.8mm length x 32.3mm width)