Date: 06/09/2010

8GB and 16GB NAND Flash memory from Samsung for Smartphone applications

Samsung has unveiled its high-performance 8-gigabyte (GB) and 16GB moviNAND embedded memory chips for use in smartphones. It was introduced at the seventh annual Samsung Mobile Solutions Forum held at the Westin Taipei Hotel. These memory devices are fully compatible with the latest e-MMC specification, the JEDEC's Embedded MultiMediaCard Product Standard v4.41.

Previously the e-MMC 4.4 interface had offered designers the flexibility of partitioning storage, such as using the single-level cell (SLC) area for high speed operations and the multi-level cell (MLC) area for high density data storage. The new that adhere to the new e-MMC 4.41 interface standard provide an upgraded user experience, with a high priority interrupt (HPI) and improved background operation features.

"We have already been providing new moviNAND solutions compatible with e-MMC v4.41 to a few key customers and getting a very positive response from them," said Seijin Kim, vice president, Flash Memory Planning/Enabling, Samsung Electronics. "These solutions are consistent with our commitment to provide a diversity of technologies for embedded memory to enhance its user-friendliness, in contributing to the rapid growth of the smartphone market."

moviNAND embedded memory chips include Samsung's high-density MLC NAND Flash & MMC controller. Samsung moviNAND chips enable hosts to execute an application or read data while the e-MMC device is writing data, the host can send an HPI command to the device so that the device stops previous writing to respond to the newest command. Also, when the Samsung embedded memory is not in operation, the host can command it to utilize the free time for background operations such as garbage compaction.

Samsung is also introducing ultra-thin five chip MCP (multi-chip package) solutions which measure just 1 millimeter (mm), a significant reduction over current four-chip MCPs that are 1.15mm in height (z-height). The moviNAND-based MCP will be available in combination with mobile DRAM. The advanced multipurpose MCP offerings will be available by the end of this year for use in mobile applications with high multimedia workload such as smartphones.

Samsung says that the production of its 8GB moviNAND, using 30 nanometer (nm) class 32-gigabit (Gb) NAND flash chips has already started in late July and production of the16GB moviNAND using 20nm-class 32Gb NAND flash will start later this month. Samsung plans to start replacing its 30nm-class 32Gb NAND flash chips with a full line of 20nm-class 32Gb NAND chips for future moviNAND products later this year.