Date: 23/08/2010

New tiny WLAN power amplifier from Microsemi for cellular handsets

Microsemi has released the LX5514M power amplifier (PA) in a compact package that it claims matches the industry's smallest 1.5x1.5mm, 0.4mm-high footprint.

Microsemi had previously introduced LX5553 and LX5543 front-end modules (FEM) to power its WLAN market. The LX5514M power amplifier further adds on to this list of device that supports IEEE 802.11b/g/n WLAN applications in the 2.4-2.5GHz frequency range. These WLAN products are used in space-constrained smartphones and other data-enabled cellular handset designs. This device is based on LX5514 PA, which has been streamlined to fit into a compact, ultra-low-profile package. Like the LX5514, the LX5514M includes fully matched input, simplified output matching, an integrated power detect function that not only saves board space but also reduces total BOM cost.

"Board area in today's smartphones is at a premium, and designers must squeeze more functionality into ever-smaller real estate," said Paul Pickle, Vice President and General Manager of Microsemi's Analog Mixed Signal Group. "The LX5514M enables designers to add WLAN capability in nearly half the space of the prior generation of 2mmx2mm PAs, and with a much lower profile that enables today's slim, sleek handset designs. Customers get the industry-leading performance and efficiency of our PAs for routers and other networking equipment, in a package optimized for the stringent space requirements of smartphone designs."

KEY FEATURES
-- InGaP HBT process technology for optimal performance and linearity
-- 2.4 -- 2.5GHz operation
-- Single-polarity 3.3V supply
-- Quiescent current 80mA
-- POUT=19dBm 3% EVM
-- Power gain 27dB
-- Total current 130mA


Package: RoHS-compliant, 6-pin, 1.5x1.5mm, 0.4mm-high dual flat no lead (DFN)

Price: US$0.45 for 10,000-unit quantities

Availability: Now