Date: 29/06/2010

32GB memory module from Samsung for server applications

Samsung has developed the 32 gigabyte (GB) load-reduced, dual-inline memory module (LRDIMM), for server applications. Samsung will begin mass production of the 32GB LRDIMM in the second half of this year.

Some of the key features of 32 GB LRDIMM are:
1. It uses Samsung's 40 nanometer-class, 4Gb DDR3 chips.
2. This module uses servers designed for virtualization, cloud computing and other high- capacity applications.
3. This prototype consists of 72 4Gb DDR3 chips and an additional memory buffer chip to help reduce the load on the memory subsystem.
4. Its memory capacity can rise up to 384 gigabytes per CPU. In a two-way server system, capacity can be increased up to 768GB, or about 1.5 times that of a 512GB server system equipped with 32GB DDR3 RDIMMs.
5. According to Samsung, a server equipped with LRDIMMs can process data at 1,333 megabit per second (Mbps), approximately 70 percent faster than the previous speed of 800 Mbps.
6. It operates at a voltage range of 1.35 or 1.5 volts.

"In developing the industry's first load-reduced module with 40nm-class DDR3 technology, we are underscoring our determination to combine the best of capacity and performance for the newest generation of servers," said Dong-Soo Jun, executive vice president, memory marketing, Semiconductor Business, Samsung Electronics.