128GB embedded NAND flash memory module from Toshiba for portable electronics

Date: 21/06/2010

Toshiba has launched the 128-gigabyte (GB) embedded NAND flash memory module. This module is fully compliant with the e-MMC3 standard. It is suggested for digital consumer products and portable electronic gadgets such as mobile phones, tablet computers and digital video cameras applications.

This module is made out of sixteen 64Gbit (equal to 8GB) NAND flash chips fabricated using Toshiba's 32nm semiconductor process technology and a dedicated flash memory controller into a small package measuring 17 x 22 x 1.4mm. These chips measure 30 micrometers in thickness. These modules offer 2GB to 128GB of flash memory. The builtin controller manages basic control functions for NAND applications, and are compatible with the JEDEC e-MMC Version 4.4 and its new features. The JEDEC e-MMC V4.4 compliant interface handles functions such as writing block management, error correction and driver software.

New Product Line-upProduct Number Capacity Package Sample Shipment Mass Production
THGBM2T0DBFBAIF 128GB 237Ball FBGA
17x22x1.4mm Sept. 2010 4Q, 2010
(Oct.-Dec.)
THGBM2G9D8FBAIF 64GB 237Ball FBGA
17x22x1.4mm Aug. 2010 4Q, 2010
(Oct.-Dec.)

Specifications e-MMC
Interface JEDEC e-MMC™ V4.4 standard HS-MMC interface
Power Supply Voltage 2.7V to 3.6V (memory core);
1.65V to 1.95V / 2.7V to 3.6V (interface)
Bus width x1, x4, x8
Write Speed*
21MB per sec.6 (Sequential/Interleave Mode)
21MB per sec.6 (Sequential/No Interleave Mode)*
Read Speed*
46MB per sec. (Sequential Mode/Interleave Mode)
55MB per sec. (Sequential/No Interleave Mode)*
Temperature range -25degrees to +85degees Celsius
Package 153Ball FBGA (+84 support balls)

For additional information visit: http://www.toshiba.com/taec/