Date: 21/04/2009

TDK developed new gigaspira multi-layer chip beads

TDK Corporation has developed three types of MMZ1005-E Gigaspira multi-layer giga hertz band chip beads with high impedance. TDK claims, these devices have highest impedance than any other similar beads in the market. Developed using original multi-layer structure technologies and ferrite material technologies, the three new products are addition to the TDK's lineup of noise eliminating products in GHz frequency range. Mass production is slated for June of 2009.

In recent years, mobile devices such as mobile phones have incorporated numerous advanced functions in addition to standard talk functions such as terrestrial digital broadcast; FM broadcast reception and GPS functions. When they are used, each of these functions requires a different signal, and if radiated noise affects the reception antenna or high-frequency circuit units, reception sensitivity can deteriorate. Consequently, it is necessary to efficiently eliminate noise from high-density mounted circuits and isolate each signal. As mobile phones become smaller and slimmer, there are increasing demands for space-saving solutions.

To respond to these market needs, TDK developed three high-impedance products that can efficiently eliminate noise over a wide band using a single chip. With the development of these new products and the start of mass production, TDK's lineup of Gigaspira beads (MMZ1005-E) comprises a total of eight types of two materials.

For details visit TDK web site at www.tdk.com.