Date: 18/02/2009

New 3G-platform solution enables enhanced mobile Internet access

Infineon Technologies launched a new platform solution enabling fast mobile Internet access with cost-optimized 3G-network connectivity.

The XMM 6130 offers a new 3G solution for mobile Internet experience with higher data rates provided by 3G HSDPA. The platform is housing the X-GOLD 613, a cellular System-on-Chip, comprising of monolithically integrated 2G /3G digital and analog base-band plus power management functionality. It is manufactured in 65nm CMOS technology.

The flagship device, the X-GOLD 613 is a base-band chip designed for cellular phones and brings together a powerful ARM11 based MCU, rich multimedia features with dedicated interfaces for camera, display, USB, memory cards and the benefits of a 3G air interface. The device supports, together with 2G/3G RF transceiver SMARTi UEmicro, the complete HSDPA (3.6Mbps) modem functionality up to 3G Dual-band and up to Quad-band EDGE.

The XMM 6130 platform solution includes a reference design, a complete RF engine, an integrated Release 6 dual-mode protocol stack with a common software API layer (UTA), and the Infineon Multimedia Framework, User Interface & Application framework.

Availability:
1. The XMM 6130 / X-GOLD 613 will sample in June 2009
2. Will be available in volume quantities in the first half of 2010

For more information please visit: www.infineon.com