Date: 12/02/2009

New Link Layer Processor SoC for WAN Networks

LSI Corporation launched its next-generation link layer processor (LLP). A single line card design, the new LLP system-on-chip (SoC) supports all major protocols and is scalable across the bandwidth spectrum from T1/E1 to STM-1, meaning that a single OEM development effort can now be leveraged across all major services and performance levels.

The features are,

1. This Link Layer processor runs on a common, highly scalable hardware and software platform, reducing both development time and the number of cards needed to provide multiple network services.
2. This LLP provides OEMs with a single, scalable, highly efficient platform which enables them to build multi-service base stations that span 2G, 3G and 4G networks."
3. In wireless applications, the LLP SoC supports backhaul of both BTS (2G) and Node B (3G) traffic to BSC (2G) and RNC (3G). Similarly, the new multi-core LLP enables the transport of multiple legacy protocols across wire-line packet networks.
4. Network uptime is maximized because the LLP continues to operate WAN modules in the event of system reboot and switches automatically to backup capacity if a system failure occurs that would otherwise impact traffic.
5. The LLP SoC provides support including Metro Ethernet, IP, MPLS, edge-to-edge pseudo-wire emulation (PWE3) using CESoPSN, SAToP, ATM, TC/IMA, HDLC/MLPPP, AAL1, frame relay and Transcoder Rate Adaptation Unit (TRAU) protocols.

Availability:
1. The new LSI link layer processor is available now.

For more details visit: www.lsi.com