Date: 20/01/2009

Low cost single chip GSM mobile phone IC

The new X-GOLD110 single chip GSM phone IC announced by Infineon is set to reduce the Bill of Materials (BOM) cost for low cost mobile phone manufacturers in emerging markets such as India and China.

The X-GOLD110 is central core part of Infineon's mobile phone platform XMM1100. The new platform supports color display, mp3 playback, FM Radio, and USB charging. The chip is also ready for dual-SIM and camera solutions. Due to low count of semiconductor and other components used, the PCB design can be managed in four layers.

The ready solution XMM1100 will enable mobile phone vendors to complete the design in 3 to 4 months due to the almost ready solution offered by this platform.

However the samples are only available in Q2, 2009 and volumes much later in second half of year 2009.