Date: 11/10/2008

EMI & ESD protection device to handle 10 high speed signal lines in flip-chip package

ST Microelectronics introduced a new device EMIF10-LCD03F3, which combines EMI filtering and ESD protection for 10 high-speed signal lines in a 1.98 x 2.08 mm flip-chip package.
ST claims that the new chip saves up to 80% of board space and 49 components over an equivalent discrete network, and achieves higher attenuation in the stop band.

Features include:

1. -40dB attenuation in the mobile frequency range 900MHz to 3GHz
2. 200MHz of bandwidth at-3dB
3. 30pF maximum line capacitance
4. 6ns max rise and fall times
5. Can withstand +15kV contact discharge at inputs and outputs.
6. Low clamping voltage of the device provides improvement in protection and reliability while maintaining signal integrity.
7. The second-order, RLC low-pass filters fabricated by inductance/capacitance cells, gives high filter performance within a smaller silicon area.
8. Implements 10 individual second-order filters with ESD protection in a 24-bump, 0.4mm-pitch flipchip package of 0.6mm profile.
9. Suitable for equipment such as cameras, cellphones, portable media players, GPS receivers, home entertainment products and digital displays.

Availability: The EMIF10-LCD03F3 is in volume production now
Pricing: $0.45 for orders of 10K pieces.

For further information visit: http://www.st.com