Date: 20/06/2008

Fujitsu to release Wimax chipsets for mobile phones

A set of three Wimax chips will be available in samples from Fujitsu Electronics in Aug 2008. These are exclusively made for mobile phones. Single Wimax module of size 12x12 mm can be build using these ICs.

The three ICs are,
MB86K22: Baseband IC
MB86K52: RF IC
MB39C316: Power Management IC

The idle current is rated below 0.5 Amps.

The key features of this chipset are,

Use power gating technology to power only selected and required blocks.
The RF IC supports 2.3GHz, 2.5GHz, and 3.5GHz.
RFIC also supports MIMO and beamforming technology.

Here below are the brief specs.

electronic components


To know further visit www.fujitsu.com






A set of three Wimax chips will be available in samples from Fujitsu Electronics in Aug 2008. These are exclusively made for mobile phones. Single Wimax module of size 12x12 mm can be build using these ICs.

The three ICs are,
MB86K22: Baseband IC
MB86K52: RF IC
MB39C316: Power Management IC

The idle current is rated below 0.5 Amps.

The key features of this chipset are,

Use power gating technology to power only selected and required blocks.
The RF IC supports 2.3GHz, 2.5GHz, and 3.5GHz.
RFIC also supports MIMO and beamforming technology.

Here below are the brief specs.

electronic components


To know further visit www.fujitsu.com