Date: 17/02/2010

New HSPA+ chip solution from Infineon for 3G smart phones

Infineon has introduced the XMM 6260, a new HSPA+ platform based on its X-GOLD 626 baseband processor and the SMARTi UE2 Radio Frequency (RF) transceiver targeting 3G Smart Phones.

The X-GOLD 626 baseband processor is based on ARM11 architecture with integrated power management unit, enabling power consumption in both active and idle mode.

The XMM 6260 3GPP Rel7 HSPA+ platform features receive diversity, interference cancellation, and CPC (Continuous Packet Connectivity), which improve power consumption and system performance.

Infineon says, the entire XMM 6260 modem platform fits in less than 600mm² PCB area, which increases the design flexibility, to create unique and feature rich handsets and mobile internet cards with innovative form factors.

"The XMM 6260 platform is the fourth generation of successful 3G platforms from Infineon perfectly matching the requirements of advanced smart phones and mobile internet devices," said Weng Kuan Tan, Division President of the Wireless Solutions Division at Infineon. "It continues the fast evolution of our leading baseband and transceiver technology by adding advanced HSPA+ features, while significantly reducing board space, power consumption, and BOM (Bill of Material) costs".

Availability: Now in samples, Volume production starts in second quarter 2011

For more details visit www.infineon.com