Date: 09/02/2010

RF power amp modules from Triquint Semiconductor for WCDMA and GSM/EDGE

RF IC specialist Triquint Semiconductor has rolled out new power amplifier modules for use in RF front end in 3G phones, data cards and netbooks. The new RF front-end solution called WEDGE family is optimized to support recently released 3G chipset solutions from Qualcomm. The new solution includes the TRITON PA Module family for WCDMA and the TQM7M5013, a HADRON II PA Module for GSM/EDGE.

"We are building on our leadership in the EDGE PAM market and our experience delivering products to the fastest growing segments of the market -- smartphones, data cards and other mobile internet devices (MIDs). The market for discrete WCDMA amplifiers, driven by the increasing number of frequency bands per wireless device, represents a significant opportunity for market share expansion," said Tim Dunn, Vice President of Mobile Devices at TriQuint. "TriQuint has worked hard to optimize our technology to offer a highly competitive, complete RF front-end solution for all of the industry's leading 3G chipset providers. Lead customers are pleased with the performance of the products and the integration roadmap. We anticipate strong market adoption for these products ramping in the second half of 2010."

The new TRITON PA Module family with footprint of 3x3mm covers all major 3GPP WCDMA bands and is capable of multi-mode operation.

The TQM7M5013, a 5x5mm quad-band, HADRON II PA Module provides the GSM/EDGE portion of the WEDGE solution when paired with the TRITON modules. The TQM7M5013 provides the building blocks for future converged/multi-mode amplifiers. TQM7M5013 is designed into more than a dozen platforms that are expected to launch in 2010. The TQM7M5013 is based on the Triquint's successful TQM7M5012. TQM7M5012 garners a 50 percent global market share in EDGE-Polar PAs.