Date: 03/02/2010

Full-wave 3D electromagnetic analysis enhances Mentor's signal/power integrity solution

Mentor Graphics has enhanced its signal and power integrity solution with the introduction of full-wave 3D electromagnetic (EM) analysis functionality that addresses the advanced simulation needs for designing PCBs and packages that utilize high-speed interconnect technologies such as SERDES, which operate at multi-gigabit-per-second speeds.

Mentor says, the new functionality is integrated in its HyperLynx product suites and will analyze, in full electromagnetic detail, 3D structures such as vias, solder bumps, wirebonds, and edge connectors.

EM simulation without accurate models, power and signal-integrity simulations cannot close the analysis gap with a high degree of confidence. The EM effects of these structures are dominating performance results in systems operating at the gigahertz (GHz) frequencies in high-speed SERDES, DDR2/DDR3, RF, and other high-frequency circuits.

"Mentor is the only supplier to provide a full PCB systems design flow including this much-needed 3D electromagnetic solution," stated Henry Potts, vice president and general manager of Mentor Graphics' Systems Design Division. "It further strengthens our technology and world market share lead and provides our customers with capabilities they need to design their advanced electronics products."

Availability: Now

For more details visit www.mentor.com