Date: 21/12/2009
Single-chip video co-processor from NXP semiconductor for 3 dimensional TV
NXP Semiconductor has made available PNX5130, a new video co-processor enabling 3DTV, frame-rate conversion (FRC) and local backlight dimming in a single chip.
NXP claims, by eliminating the need for external FPGA devices to support 3DTV, it is providing a high cost-effective post-processing solution that will enable manufacturers to bring competitively priced 3D-enabled TV sets to the mainstream consumer market.
The key features of the PNX5130 video co-processor are,
3DTV algorithms and format converters enabling conversion of all 3DTV formats to line interleaved (60/120Hz) and frame interleaved (120/240Hz) displays
Better motion sharpness technology and full motion compensated up-conversion (ME/MC) to 1920 x 1080p at 120Hz and 240Hz
HD halo-reduced movie judder compensation and motion blur reduction
Integrated local dimming feature for combined local dimming and MEMC (Motion Estimation, Motion Compensation) applications
Offers wide color gamut mapping, skin tone protection, green, blue and white stretch, sharpness enhancements (2D peaking, LTI, CTI, CDS), and contrast enhancements
Dynamic backlight control and 2D (local) dimming for 120Hz and 240Hz TVs
The PNX5130 also features the NXP's MAPP (Motion Accurate Picture Processing) technology, which combines movie judder cancellation, motion sharpness, and vivid color management in a single device.
"3DTV is the new product differentiator for home entertainment systems," said Vincent Vermeer, product marketing director for digital TV systems, NXP Semiconductors. "With the growing popularity of 3D movies, we expect to see a much wider range of 3D content - including broadcast content and games - become available for TV viewers over the next two years. The challenge for TV manufacturers will be how to make the 3D viewing experience more affordable for the average consumer. The PNX5130 is a critical part of the solution combining support for 3DTV, FRC and local LED backlight dimming in a single integrated chip, reducing the total bill of materials."
Availability: Now in samples, the final software release will be available in Q1 2010
For more details visit www.nxp.com