Date: 07/12/2009

Integrated fansinks offers low profile active cooling solutions

Cool Innovations has introduced an integrated fansinks that packs a pin fin heat sink and a fan that is embedded into the heat sink's pin array to provide low profile active cooling solutions.

The heat sinks possess substantial surface area and are composed of high conductive materials, the structure is suitable for fansink configurations and the use of round pins generates additional turbulence inside the pin array. The fans used are compact yet powerful in nature, generating 6.1 CFM.

The integrated fansink line solutions are available from a minimum overall height of 0.42" to a maximum overall height of 0.63", and suitable to fit into single slot PCI Express (0.42" height) & ATCA applications (0.63" height) or for any other applications that are restricted in height.

The new integrated fansinks are available in copper and aluminum, and range in footprint from 1.81" x 1.81" to 4.10" x 2.05", and in height from 0.42" to 0.63". They are supplied with a high reliability bracket fan (6.1 CFM, 12V, 0.2 AMP).