Date: 30/11/2009

Application processor chip from Renesas for video rich smart phones

Renesas is sampling the SH-Mobile Application Engine 4 (SH73720), an ARM Cortex-A8 based application-processing engine running at maximum frequency of 1GHz. The chip is designed for enabling mobile phones to handle high definition video and graphics.

With the integration of various video processing engines, the SH73720 device features multimedia capabilities such as full HD 1080p video recording, playback at 30fps, and high speed 3D graphics rendering for 3D user interfaces and an advanced gaming experience.

By leveraging Renesas' Image Signal Processor (ISP) technology, the SH-Mobile Application Engine 4 provides a 16Mpixel ISP for high visual quality while supporting full HD 1080p movie processing. SH73720 also offer IP for edge enhancement or median filtering for better experience of image viewing on portable/handheld electronic gadgets.

"With broadband wireless access like UMTS/HSPA or LTE, customers can have the Internet at their fingertips wherever and whenever. Access to music, videos and games with mobile phones becomes as simple as it became on the PC a few years ago" says Shinichi Yoshioka, General Manager of System Solution Business Unit2, System Solution Business Group, Renesas Technology Corp. "Renesas has developed the SH-Mobile Application Engine 4, as the first device of the SH-Mobile Application Engine Series in a new class of application processors to offer an entirely new user experience on mobile computers and to solve the conflicts around creating an exciting multimedia experience within the low power budget of mobile devices."

The SH-Mobile Application Engine 4 includes two USB 2.0 Host/Function modules (with high-speed data transfer mode support), three SD host controllers with support for high-speed data transfer mode and a 24-bit TFT color LCD controller supporting up to WXGA+ display sizes. Furthermore a PAL/NTSC encoder and an HDMI transmitter are integrated together with a HDMI v1.3a & CVBS TV-Out interface.

Package: 0.4mm pitch, 12mm × 12mm BGA package