Date: 17/07/2009

New pHEMT transistors and HBT broadband MMICs in SMT packages

The IXYS company Microwave Technology (MwT) has introduced a set of AlGaAs/InGaAs pHEMT and InGaP HBT based high frequency products and broadband MMIC amplifier products in surface mount packages.

MMA-020624-L3 is a 2 to 6 GHz wideband linear driver with 25-dBm linear output power, 15 dB of gain, and a linearity of 40 dBm OIP3. MMA-011015-C5 is a 1 - 10 GHz broadband driver with 15-dBm linear output power and 15 dB of gain. MMA-061829-10 is a 6 to 18 GHz broadband power amplifier with 30dBm (1 watt) of saturated power and 8 dB of gain. MMA-121630-S7 is a 12 to 16 GHz power amplifier with 32 dBm (1.6 watts) of saturated output power and 26 dB of gain. MMA-022028-S7 is a 2 to 20 GHz distributed power amplifier with 29 dBm of saturated output power and 8 dB of gain across the band. MHA-051023D-88 is a 50 MHz to 1,000 MHz linear driver with excellent linearity. The push-pull amplifier provides 24 dBm of linear output power, 16.5 dB of gain, 42 dBm of OIP3, and 76 dBm of OIP2. Hermetically sealed packages are also available for these MMIC products.

Dr. Greg Zhou, General Manager of MwT, commented, "We continue to develop and optimize the performance of high frequency and broadband MMIC parts in various surface mount packages targeted at a wide range of applications including broadband military EW and defense communications, wireless infrastructures, point-to-point microwave radios, instrumentation, CATV/FTTH and others. These fully matched MMIC amplifiers housed in surface mount packages are designed for ease of use by our customers in terms of assembly and RF system integration."

Package:

MMA-020624-L3: 3mm x 3mm QFN package.
MMA-011015-C5: 5 mm x 5 mm QFN package.
MMA-061829-10: 10 mm x 10 mm ceramic package.
MMA-121630-S7: 7mm x 7mm package.
MMA-022028-S7: 7mm x 7mm ceramic package.
MHA-051023D-88: SOIC-8 package.

For more detailed visit www.mwtinc.com