Date: 07/10/2009

MagnaChip Semiconductor unveiled 7 types of MOSFETs for notebooks

MagnaChip Semiconductor unveiled 7 types of MOSFET packages for notebooks (part numbers: MDV 2655 to 2660, MDV 1660). The part numbers utilize PowerDFN33 MOSFET package that provides package with size and height shrunk 63% and 33%, respectively but with electrical and heat performance the same as the SOIC-8 package which has been adopted for notebooks.

The PowerDFN33 MOSFET release has added package lineup for computers, making four package types available, including DPAK, SOIC-8, and upgraded PowerDFN56 and PowerDFN33.

MagnaChip also plans to offer dual channels, which have two chips embedded in one package, easy to design PCBs and feature better heat protection through even heat distribution.

"These new PowerDFN3x3 solutions allow MagnaChip to provide a total solution for mobile applications including notebook and netbook computers. These latest offerings allow us to better serve customer needs." and "We intend to increase our share in the MOSFET market by continuing to release industry leading products and packages in the future," said Sang Park, CEO of MagnaChip.

For more details visit www.magnachip.com

Editorial rating of this new product: Average