Date: 05/09/2009
Quad-band polar EDGE power amplifier IC for 3G technology from Anadigics
Anadigics has introduced the AWE6159, a new quad-band polar EDGE power amplifier (PA) module supports dual/tri/quad applications for GMSK and EDGE modes in mobile devices using open-loop polar modulation schemes.
The AWE6159 also includes separate amplifier chains to support GSM850/900 bands and for DCS/PCS bands to deliver GMSK and 8-PSK modulated RF with superior efficiency and low harmonics. In addition, the AWE6159 adds voltage-tracking circuitry to assure output RF Spectrum (ORFS) meets requirements at low battery voltage conditions.
Key features and specifications include,
Internal reference voltage, integrated power control
InGaP HBT technology
ESD protection on all pins (2.5 kV)
Automatic VBATT tracking
Low profile 1.0 mm
EGPRS Capable (class 12)
RoHS Compliant Package, 250 °C MSL-3
Halogen-Free
GMSK mode:
Integrated power control (CMOS)
+35 dBm GSM850/900 Output Power
+33 dBm DCS/PCS Output Power
55 % GSM 900 PAE
51 % DCS/PCS PAE
Power control range > 50 dB
EDGE mode:
+29 dBm GSM850/900 Output Power
+28.5 dBm DCS/PCS Output Power
28% GSM850/900 PAE
28% DCS/PCS PAE
64 dB Typical ACPR (400 kHz)
74 dB Typical ACPR (600 kHz)
"The new, much smaller AWE6159 includes an integrated power control for GMSK and EDGE modes to allow easy conversion between these two modes. It's this key feature that successfully drove the adoption of our AWT6280 EDGE PA into millions of handsets, smartphones and data devices," says Bruce Webber, Director of Marketing at ANADIGICS. "Many GSM operators have upgraded their networks, and EDGE capability is being designed into forthcoming WCMDA/HSPA mobile devices to provide the necessary compatibility."
Joe DeMoura, EDGE Product Line Director at ANADIGICS, Inc. states, "The highly integrated AWE6159 directly addresses the needs of the 3G marketplace by delivering the higher saturated output power levels required for multi-mode devices, together with the linearity required for spec-compliant performance from top-tier 3G chipsets. The 49% size reduction significantly decreases board area while the lower battery current meets the growing efficiency requirements of 3G devices to preserve battery life and extend talk/data time."
Package: Small package outline 5 mm x 5 mm
Availability: Now in samples
For more details visit www.anadigics.com