Date: 29/04/2010

Samsung launches multi chip packaged PRAM devices for mobile phones

Samsung has introduced multi-chip package (MCP) memory devices made using PRAM chips for use in mobile phones. The 512 megabit PRAM MCP is backward compatible with 40 nanometer-class NOR flash memory in both its hardware and software functionality allowing mobile handset designers to replace NOR flash with PRAM devices easily.

"Memories for portable consumer devices today are at a major turning point as mobile applications increasingly require more diverse memory technologies," said Dong-soo Jun, executive vice president, Memory Sales and Marketing, Samsung Electronics. "The launch of our PRAM in an advanced MCP solution for the replacement of 40nm-class and finer geometry NOR meets this need head-on. Our PRAM MCP will not only enable handset designers to utilize conventional platforms, but expedite the introduction of LPDDR2 DRAM and next-generation PRAM technology as the leading-edge basis for high-performance solutions," he added.

The PRAM base material used is an alloy of germanium, antimony and titanium which stores data via phase change characteristics and provides three times faster data storage compared to flash memory. PRAM offers DRAM speed but with non-volatile advantage.
Use of PRAM enhances the speed of operation of software inside phones.