Date: 15/03/2010

Temperature sensor VLSI IP core from Ensphere Solutions

Ensphere Solutions has announced the availability of a new enhanced temperature sensor IP core ESI-P3010 for VLSI SoC chip design. ESI-P3010 is a power and area optimized IP implemented in mainstream processes such as TSMC 65nm-G and TowerJazz 180 nm.

This IP core consists of a temperature sensor connected to one of the eight inputs of an analog multiplexer. The output of this multiplexer can be scaled by a programmable gain stage prior to being digitized by a 16-bit Sigma-Delta ADC. The remaining seven DC input channels can be used for signal monitoring and digitizing of other analog input signals. Virtually all key parameters of this core is user programmable per channel basis including the gain, calibration settings (offset and slope), and filter parameters. The total area of this IP is 0.25mm2 and total power dissipation is 4.9mW with all channels active. The total power down current is 19nA.

"The capabilities of this IP go far beyond a generic temperature sensor. It can be used to monitor die temperature as well as seven other DC levels. Highly customizable nature of this IP makes it suitable for most SoCs with various degrees of complexity" said Al Gharakhanian, Vice President of Marketing at Ensphere Solutions.
For more info visit www.enspheresolutions.com