Date: 19/02/2010

New camera display bridge chips from Toshiba for mobile phones

Toshiba has made available three new bridge chips for use in mobile phones, a Mobile Industry Processor Interface (MIPI) camera serial interface (CSI) to a Mobile Display Digital Interface (MDDI) chip (TC358740XBG) and two MDDI-MIPI display serial interface (DSI) chips (TC358760XBG and TC358761XBG). These new bridge ICs provide high-speed serial interfaces between a mobile phone's baseband or application processor and the phone's display or integrated camera and are a requirement for high-resolution displays and cameras used in smartphones, mobile internet devices, netbooks, smartbooks and other high-performance mobile devices.

The TC358740XBG camera bridge chip provides connectivity for MIPI cameras to baseband or application processors using an MDDI interface. The bridge chip supports MDDI 1.2 Type 2 on the Host side. The device offers support for up to two cameras, with the primary camera using a MIPI link and the secondary camera using a MIPI link or parallel port. The bridge enables high-speed serial interfaces on both the Host via MDDI and camera side via MIPI CSI-2 allowing support for up to 12 megapixel primary camera and up to 2 megapixel secondary camera in one handset. It is compatible with systems using baseband processors with an MDDI interface.

The Toshiba TC358760XBG and TC358761XBG display bridges are optimized for mobile handsets using an MDDI high-speed serial digital packet host interface and provide connectivity of MIPI display panels to baseband or application processors using an MDDI interface.

"Toshiba's mobile peripheral devices are a family of connectivity chipsets that enable flexibility in mechanical design, a broader selection of major components such as displays and cameras, reduction in power consumption, and reduction in EMI issues in handheld devices such as smart phones, mobile internet devices, netbooks, smartbooks, eBooks, and personal media and navigation devices," said Deepak Prakash, director, Digital Multimedia Business Development in the ASSP Business Unit at TAEC. "The TC358762XBG deserializer bridge chip uses the MIPI high-speed serial interface to deliver the large data bandwidth needed for displaying high-resolution video content."

Toshiba has also introduced the TC358762XBG, a new deserializer display bridge chip that connects the baseband or application processors for smart phones, which use Mobile Industry Processor Interface-Display Serial Interfaces (MIPI-DSI), to high resolution displays with parallel interfaces.

The TC358762XBG deserializer bridge IC supports video input frame rates of up to 60 frames per second for XGA and 30 frames per second for 720P. It uses a dual-lane DSI receiver that is bi-directional at lane 0 and supports data rates of up to 800 Mbps per lane for total data bandwidth of 1.6Gbps. The chip's DPI host has a bus speed of up to 70 MHz burst rate. The device can also be used to connect pico projectors to baseband and application processors to enable embedded digital projector applications in mobile devices.

Toshiba says that the TC358762XBG bridge chip has been thoroughly tested for interoperability with the ARMADA 610 application processor by Marvell and is included in Marvell's ARMADA 610 reference design.


Price: All the above parts are priced at each $1.50 for 10K pieces
Availability: All the above now in samples

For more details visit www.toshiba.com