Date: 09/11/2006

Cypress and Winbond jointly built a demo kit for VOIP headset.

Cypress with it's flash microcontroller and Winbond's codec has launched development kit for Wireless VOIP headset. The test board is made of Cypress's low-power WirelessUSB™ LP (CYRF6936) 2.4-GHz radio system-on-chip, Wireless enCoRe II flash microcontroller and Winbond's W681360 CODEC.

The issue of packet-dropping is addressed in this kit which provides uninterrupted flow of data. The wirelessUSB protocol of Cypress is robust in terms of interference immunity and suppose to perform better than Bluetooth and DECT based solutions.
Winbond's W68130 is selected for it's signal quality and low power consumption..

The key advantages of this kit are, low power consumption, range, robustness, and also low cost.

The kit is bundled with following items:
WirelessUSB LP Headset Board; made of Cypress WirelessUSB LP (CYRF6936), Wireless enCoRe II (CY7C60323) flash MCU and Winbond (W681360) 3V Single-Channel CODEC
WirelessUSB LP Bridge; made of WirelessUSB LP (CYRF6936) and enCoRe III (CY7C64215) USB flash MCU
WirelessUSB LP Demo Kit CD-ROM with schematics, BOM, and firmware

Available: Now
Price: $249