Date: 29/11/2011

AEC-Q101-qualified 2 Amp power transistor packed in leadless DFN package

NXP Semiconductor has introduced the new range of medium power transistors in the very small DFN2020-3 (SOT1061) package. This AEC-Q101 qualified, 2 x 2 mm housing features an exposed heat sink.

As per NXP, it is suitable for general purpose, power sensitive applications in mobile, automotive, industrial and household appliances, the new SOT1061 packaging can save up to 80 percent more PCB space compared to conventional SOT89 packages, while maintaining high electrical performance of up to 2 A.

Key features of the product include:
Leadless very small SMD plastic package with medium power capability
Exposed heat sink for excellent thermal and electrical performance
VCEO ranging from 20 V to 80 V
High collector current capability IC (up to 2 A) and ICM (up to 3 A)
AEC-Q101 qualified

NXP says when mounted on state-of-the-art 4-layer PCBs, its thermal performance matches much bigger standard SMD packages and allows Ptot levels of up to 1.1 W in a tiny footprint. All NXP medium power transistors are automotive-qualified according to AEC-Q101.