Date: 18/05/2023

Are you looking for an i.MX 93 application processor RDV from PE Co?

Are you looking for an i.MX 93 application processor reference dev. Platform board powered by ARM Cortex A55 with some machine learning capabilities from a 3rd party developer who has software and product engineering expertise and owned by leading component distributor Arrow, so that you can also connect for sourcing support.

The name of the company in Gujrat India based eInfochips which has launched Reference Development Platform (RDP) based on NXP Semiconductors’ i.MX 93 applications processors.

“As an early access partner for the NXP i.MX 93 platform, eInfochips is proud to offer our clients a cutting-edge reference development platform. This platform enables customers across smart home, smart city and industrial verticals to quickly prototype their ideas and bring them to reality”, says Parag Mehta, chief sales, and business development officer at eInfochips.

Here are the more details from company's release:

NXP’s i.MX 93 applications processor combines both a level of performance and low power that will enable a wide range of innovative edge devices. eInfochips’ RDP will enable a wide range of customers to rapidly prototype and move into production.

Jeff Steinheider,
Vice President and General Manager, Industrial Edge, NXP

The EIC-i.MX93-210 is an RDP kit based on NXP’s i.MX 93 applications processor. The processor includes the scalable Arm Cortex-A55 Core, which enables efficient machine learning acceleration and advanced security with an integrated EdgeLock secure enclave to support edge computing.

This RDP enables developers to kick-start the development of creating more capable high-performance, cost-effective, and energy-efficient machine learning applications. As engineers progress in their product development journey, eInfochips can support them in accelerating time to market with its 25-plus years of ER&D experience. eInfochips’ expertise spans across hardware development, firmware, edge-AI enablement, end-to-end design and manufacturing.

The next-generation NXP i.MX 93 processor is a robust innovation that provides new use cases and opens a new gateway to a faster, more secure, powerful, and advanced edge-based system for industrial automation, smart home and intelligent appliances, smart buildings and automotive applications.

For more details on EIC-i.MX93-210, please visit eInfochips website
at:
https://www.einfochips.com/wp-content/uploads/resources/IMX93-DataSheet_V4.pdf

Some more tech specs:

Processor
NXP iMX935, iMX933
Two Cortex®-A55 processors
operating up to 1.7 GHz
64-bit Arm® v8.2-A architecture
MPE with Arm® NEONTM
Floating Point Unit (FPU) with
support of the Arm® VFPv4-D16
architecture
One Cortex®-M33 CPU operating
up to 250 MHz
NPU targets 8-bit and 16-bit integer
RNN, handles 8-bit weights.

Memory and Storage
1x 2GB LPDDR4x RAM
1x 16GB eMMC 5.1
1x SDIO 3.0 interface
(mux with WLAN)
1x SD Card 3.0 interface

Connectivity
Wi-Fi:
AWCM276NF - IEEE 802.11 a/b/g/n/
ac, 2.4/5.0 GHz
2x MHF4 antenna connector

Bluetooth:
Bluetooth 2.1 and 3.0+ Enhanced
Data Rate (EDR) + BT 5.3

USB
2x USB2.0 with DRP
(USB Host mode support only,
current BSP does not have support
of DRP mode)

Ethernet
1x RGMI Interface

Display
1x 4-Lane MIPI DSI v1.2 interface
1x 4-Lane LVDS
1x HDMI interface

Camera
2 Lane MIPI CSI-2 v1.2 interface
8-bit RGB interface (Mux)

Audio
3x SAI
1x PDM

Sensors
1x 4 channel current sensor

Other
1x CAN Interface
3x UART, 4x I2C, 2x SPI, 4x ADC,

GPIOs
1x Reset Switch, 1x ON/OFF Switch

Power Specification
SOM: 3.8V to 5.5V (Typ. 5V)
Carrier (Kit): 10.8V to 13.2V (Typ. 12V)

Mechanical Specification
SOM: 65mm x 55mm
Carrier Board: 85mm x 100mm

Operating System
Linux

Orderable Part
SOM + Carrier
SOM + Carrier + LVDS/DSI Daughter
Board
SOM + Carrier + Multimedia
Mezzanine
SOM + Carrier + RGB Camera Board
SOM + Carrier + Multimedia
Mezzanine + LVDS/DSI Daughter
Board
SOM + Carrier + RGB Camera Board
+ LVDS/DSI Daughter Board

News Source: www.einfochips.com