26% growth of global smartphone sales in 1Q 2021, as per Gartner
ABI: Wireless headset shipments will reach over 1 billion units in 2025
Lumentum, Ericsson, Nokia and Other jointly bring out MOPA tech paper
TSMC, ASE, JCET and Amkor market shares reach 95% in Fan-Out market
OPTAGE next-gen Android TV uses Amino streaming tech
Joint research center on advanced materials for sensors by ST and Politecnico
51% growth global semicon equipment billing in 1st Q 2021
Panasonic develops AI dataset of human activity in homes
Cobot's Market is valuated over US$600 million in 2021
Monitoring storm water through IOT
Extreme low power capabilities connect Winbond and Ambiq' chips
STMicroelectronics to acquire embedded AI software specialist Cartesiam
Robust growth in DRAM revenues in 1Q21 for both big and small vendors
LED market updates in 2nd Q 2021 from Trendforce
ON Semi reports record automotive revenue of $515 million in 1st Q 21
Strong FPGA demand helps Xilinx generate high quarterly revenue in 2021
Socionext to make APIX3 tech based chips
Silvaco acquires Ukraine based POLYTEDA
20 Gbps multiplexer/demultiplexer from Diodes with higher signal Integrity
5 GHz FEMs integrate a HF BAW filters
ASIL-B ready angle sensor to detect positions of clutch or brake pedals
GAN FET based 1000 Watt demo board from EPC offer high power density
Space saving TVS devices for automotives deliver high performance
Health monitoring device uses Celluar IoT for high speed and secure data
Himax launches phase modulation LCoS for automotive head-up display
HD MWIR thermal camera from Excelitas for long range use
20Gbps Multi-Channel Mux/Demux from Diodes for range of apps
Handheld XRF Analyzer for elemental detection
EMCORE shipping L-band fiber optic transmitter and receiver pairs
Silicon Labs Z-Wave 700 module powered Ezlo hubs
Automotive grade two-wire hall switches for proximity and position sensing
Yachts and luxury boats gets smart-home like control sys
Automotive-grade USB Type-C port protector
H-Bridge motor drivers for electronic throttles
New KLA' metrology systems to test semiconductor molecular skyscrapers
Die to wafer bonding equipment for utraintegrated 3D Ics
