Latest EE News 25-Jan-2018

• Semiconductor and electronics industry acquisition at the start of 2018
• Micron and Intel take separate paths in developing future 3-D NAND flash
• Altair to set up CoE in collaboration with BMS College of Engineering in Bengaluru
• ROHM targets Indian EV specific automotive semiconductor market
• Atos proposes to acquire Gemalto
• ELEXCON 2017 in Shenzen to cover lot on smart phone and its application areas
• Best papers at VLSI verification event TrueConnect 2017
• Alliance memory records 1K design registrations
• The Zigbee Alliance and Thread Group offer Dotdot specs over Thread’s IP network

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Latest EE News

• ADAM: Episode 3 created using Unity
• Strong early iPhone X growth in rich countries
• Wireless IoT devices in farming reached 17.0 million in 2016
• Third Quarter of 2017 was a growth quarter for top 5 smart phone vendors
• Global IoT market to expand from NT$97.6 billion to NT$362 billion in 2020

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Latest EE Products 25-Jan-2018

• Smart mirror tech to replace traditional rearview and side mirrors
• World's first 24/7/365 connected car Cyber-Security as a Service
• STMicroelectronics and Usound sample MEMS Micro- Speakers
• Lattice’ SiBEAM Snap Wireless Connector Tech in Fujitsu' Q508 Tablet PC
• Wireless charging coil for non-phone applications
• APNEAband by Leti detects sleep-apnea and does other health monitoring tasks
• Telit 4 In-module IoT dev environment support for Lua on BLE modules
• Face detection supporting 8MP MIPI camera module for Qualcomm Snapdragon SBC SKATE-212
• 3-channel high-side linear automotive LED controller

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More EE Products

• ST and AWS collaborate FreeRTOS IoT node-to-cloud solutions
• Perfluoroelastomer compound developed by DowDuPont for semiconductor fab
• Microsemi announced version 2 of its Libero FPGA software

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